TTT – Time Temperature Transformation
CCT – Continuous Cooling Transformation
ELS – Electrophoretic Light Scattering
MFM – Magnetic Force Microscope / Microscopy
RDF – Radial Distribution Function
QENS – Quasielastic Neutron Scattering
ISE – Indentation Size Effect
LFZ – Laser Floating Zone
SPM – Scanning Probe Microscope / Microscopy
MBE – Molecular Beam Epitaxy
PEEM – Photoemission Electron Microscopy
LEED – Low Energy Electron Diffraction
MTA – Microthermal Analysis
STM – Scanning Tunnel Microscope / Microscopy
ICR – Ion Cyclotron Resonance
GB – Grain Boundary
EBSP – Electron Backscattered Pattern
SIGBM – Strain Induced Grain Boundary Migration
RSF – Relative Sensitivity Factor
DEA – Dielectric Analysis
EPMA – Electron probe Microanalyzer/ Microanalysis
GBS – Grain Boundary Sliding
HREM – High Resolution Electron Monitoring
TM – Thermomechanometry
LEEM – Low Energy Electron Microscopy
ECSA – Electron Spectroscopy for Chemical Analysis
FIM – Field Ion Microscopy / Microscope
MAC – Mass Absorption Coefficient
ESF – Extrinsic Stacking Fault
ISF – Intrinsic Stacking Fault
LHPG – Laser Heated Pedestal Growth
ECMs – Engineered Cellular Magmatics
SRX – Static Recrystallization
DRX – Dynamic Recrystallization
EELS – Electron Energy Loss Spectroscopy
IGC – Intragranular Corrosion
ODT – Order Disorder Transition
YPE – Yield Point Elongation
DSC – Differential Scanning Calorimetry
WDXS / WDS – Wavelength Dispersive X-ray Spectroscopy
LEIS – Low Energy Ion scattering Spectroscopy
VLEED – Very Low Energy Electron Diffraction
DMA – Dynamic Mechanical Spectroscopy
XPS – X-ray Photoelectron Spectroscopy
FGM – Functionally Graded Material
ATR – Attenuated Total Reflectance
DAC – Diamond Anvil Cell
SAD – Selected Area Diffraction
GBA – Grain Boundary Allotriomorph
TMA – Thermomechanical Analysis
